microDICE - Wafer dicing system for SiC
5.9 هزار بار بازدید -
6 سال پیش
-
The revolutionary, high-performance microDICE laserdicing
The revolutionary, high-performance microDICE laser
dicing system brings TLS-Dicing technology (Thermal-
Laser-Separation) to semiconductor‘s back-end.
The microDICE separates wafers, including SiC, into dies
with an outstanding edge quality while increasing the yield
and the throughput.
dicing system brings TLS-Dicing technology (Thermal-
Laser-Separation) to semiconductor‘s back-end.
The microDICE separates wafers, including SiC, into dies
with an outstanding edge quality while increasing the yield
and the throughput.
6 سال پیش
در تاریخ 1397/06/29 منتشر شده
است.
5,973
بـار بازدید شده