Stealth Dicing Process / Hamamatsu Photonics K.K.

Stealth dicing is a "completely new laser dicing technology" developed by Hamamatsu Photonics.
Stealth dicing may perhaps be considered a large-scale fusion of laser technology and optical technology including laser processing devices and IC thin-film removing apparatus produced for the world's markets based on long accumulated technology from Hamamatsu Photonics. This technology is mountable as unit modules in dicing equipment in what amounts to a "Stealth Dicing Engine" that Hamamatsu Photonics proudly offers to its customers.
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Inquiry:
(English) https://www.hamamatsu.com/all/en/supp...
(Japanese) https://www.hamamatsu.com/jp/ja/suppo...

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