microDICE - Wafer dicing system for SiC
82.6 هزار بار بازدید -
9 سال پیش
-
The revolutionary, high-performance microDICE laserdicing
The revolutionary, high-performance microDICE laser
dicing system brings TLS-Dicing technology (Thermal-
Laser-Separation) to semiconductor‘s back-end.
The microDICE separates wafers, including SiC, into dies
with an outstanding edge quality while increasing the yield
and the throughput.
dicing system brings TLS-Dicing technology (Thermal-
Laser-Separation) to semiconductor‘s back-end.
The microDICE separates wafers, including SiC, into dies
with an outstanding edge quality while increasing the yield
and the throughput.
9 سال پیش
در تاریخ 1394/01/05 منتشر شده
است.
82,651
بـار بازدید شده