Origin of the FOUP

Gary Gallagher, senior director and "Father of the FOUP," takes you through wafer transport evolution from open cassettes and bottom-opening SMIF pods to the revolutionary front-opening unified pod (FOUP), designed for 300 mm wafers. Twenty years later, our 300 mm FOUPs are still processing and transporting the most advanced chip technology in 120-plus fabs across the globe. Runtime: 06:33