IC DIE pick and place, Wire bonding recorded with high speed camera, by HI-TECH ELECTRONICS
43.6 هزار بار بازدید -
7 سال پیش
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A collection of high-speed camera
A collection of high-speed camera recording on IC DIE pick and place, Wire bonding, by HI-TECH ELECTRONICS, Volume 1
7 سال پیش
در تاریخ 1395/12/15 منتشر شده
است.
43,632
بـار بازدید شده