WIRE BONDING (PART 2)

Wire bonding (wirebonding) is a process step of semiconductor packaging (assembly). This is part 2 of learning video related to wire bonding process ( ball bonding ) using gold wire.  You will learn in this video key things in wire bonding process such as properties of bonding pad, capillary ( bonding tool ) design and how it affects first bond (bonded ball), second bond ( stitch / wedge ), and loop height. Also included in this video are methods to test bond strength ( wire pull and bond shear ) and sample photo of bonding visual defects.

This video is created and published by Watch Learn 'N Play channel ( @watchlearnnplay  ) as part of semiconductor packaging learning video series. This video is intended for beginners. Thank you for watching!

DON'T FORGET TO WATCH SEMICONDUCTOR PACKAGING - WIRE BONDING (PART 1) VIDEO TO LEARN MORE ABOUT WIRE BONDING PROCESS USING GOLD WIRE.

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