High Speed Solder Ball Attach and Laser Reflow with SB²-Jet | Advanced Packaging Equipment

The SB²-Jet provides fine-pitch soldering capability supported by a high accuracy axis system. It has the smallest solder ball diameter capability down to 40μm. it is ideal not only for research & development, prototyping of advanced devices but especially also for mass production. ____________________________________________________ Website: pactech.com Facebook: www.facebook.com/pactech.packagingtechnologies Xing: www.xing.com/pages/pactech-packaging-technologies-… LinkedIn: www.linkedin.com/company/pactech-packaging-technol…

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