Introducing Innovator3D IC

Introducing Innovator3D IC! This new software delivers a fast, predictable path for the planning and heterogeneous integration of ASICs and chiplets using the latest and most advanced semiconductor packaging 2.5D & 3D technologies and substrates in the world.

Innovator3D IC provides a consolidated cockpit for constructing a digital twin — featuring a unified data model for design planning, prototyping and predictive analysis — of the complete semiconductor package assembly. This cockpit drives implementation, multi-physics analysis, mechanical design, test, signoff, and release to manufacturing.

By unifying power, signal, thermal, and mechanical stress analysis tools, it enables rapid ‘what-if’ exploration, while identifying, avoiding and solving challenges prior to detailed design implementation. This shift-left approach can prevent costly and time-consuming downstream rework or suboptimal results.

⭐Learn more about Innovator3D IC on our website: https://sie.ag/8C3nU  

➡️ Connect with us:  
» LinkedIn: https://sie.ag/6HDNDB
» Blog: https://sie.ag/3B7rk8
» IC Packaging Community Discussion Board: https://sie.ag/3QtLn6
» X: https://sie.ag/4pSE9H

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