Diamond Multi Wire Saw

Diamond Multi Wire Saw is the precision slicing tool, advanced and intelligent, to cut the hard and brittle materials like sapphires, silicons, magnets, advanced ceramics, glass, rare metals and alloys, optics, crystals, semiconductor materials and so on. It can cut one block into lots of wafers or substrates at the same time, designed for high volume wafer production.

Shirly Chen  
[email protected]
Skype:   live:a.shirly

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