Power Cycling on sintered SiC modules

Marcus Lippert, Business Development Manager, StarPower:
Reliable packaging technologies are key for widespread adaptation of power modules with SiC chip configuration. A key benchmark test is power cycling as it gives a good indication on the potential life time of the module in the field. StarPower presents power cycling results of its SiC Mosfet module range. You are provided with an overview on power cycling capabilities of current chip and packaging technologies as well as an outlook of the next step packaging improvements to further increase reliability of SiC based modules.