SET - ACCµRA M Flip-Chip Bonder

The ACCμRA M is a manual Flip-Chip Bonder permitting to reach ± 3 μm post-bond accuracy.

The only motorized axis is the arm, which controls precisely the bonding force.

Combining and synchronizing the arm with the temperature controller, it guarantees a perfect quality and high repeatability of your process.

The ACCμRA M, more than a pick-and-place system, offers thermocompression and reflow capabilities.

It is the perfect equipment for universities and R&D institutes.

For more information, visit http://www.set-sas.fr