8327GL 25ML Silicone-Free Thermal Gels Heatsink Application

8327GL Series are 1-part, silicone-free, thermally conductive gels for exceptional thermal management of energy intensive devices. These products have very high thermal conductivity, flame retardancy and an ideal viscosity for form-in-place application.

The low modulus of these gels makes them an ideal material for placing near delicate components or aggressive thermal cycling applications. These gels do not cure so devices can be powered up for use immediately following application.

Features & Benefits

Very high thermal conductivity between 3.5 and 6.0 W/(m·K)
Flame retardant—meets UL94 V-0
Low bond line thickness
Low modulus—ideal for delicate components
Wide operating temperature range
1-part gel
Silicone-free
Tack adhesion—does not run
Reworkable

For more information, please visit: www.mgchemicals.com