Package Technology in IC (SIP, DIP, PGA, Surface Mount Package & Contactless Package) Explained

Engineering Funda
Engineering Funda
38.5 هزار بار بازدید - 4 سال پیش - Comparison of Package Technology in
Comparison of Package Technology in IC is explained with the following timecodes:

0:00 - VLSI Lecture Series
0:12 - Outlines on Package Technology in IC
0:30 - Through Hole Package
1:33 - SIP (Single In line Package)
3:21 - DIP (Dual In Line Package)
5:01 - PGA (Package Grid Array)
7:00 - Surface Mount Package
10:53 - Contactless Package

Following points are covered in this video:

0. Package Technology in IC
1. Classifications of Package Technology in IC

Here, i have explained following Package Technology in VLSI
1. Through Hole Package
2. Surface Mount Package
3. Contact Less Package

Chapter-wise detailed Syllabus of the VLSI Course is as follows:

Chapter-1 Introduction to VLSI Design: Introduction to VLSI Design
Evolution of Logic complexity, VLSI Design methodologies, Full Custom design and Semi Custom design, VLSI terminologies, Package Technology of IC, VLSI Design flow, Importance of CAD tools in VLSI, Comparison of FPGA, CPLD, PLC, DSP, Microcontroller and Microprocessor.

Chapter-2 CMOS Fabrication: CMOS Fabrication
CMOS Fabrication process, Twin Tube CMOS Fabrication Process, Photolithography, Ion Implantation.

Chapter-3 MOS and MOSFET: MOS and MOSFET
Two Terminal MOS structure, Flat band voltage, MOS under external bias, MOSFET, Threshold voltage of MOSFET, Gradual Channel Approximation of MOSFET, Channel Length Modulation of MOSFET, Substrate Bias Effect in MOSFET, MOSFET Capacitances, nMOS and pMOS, Examples on MOS, MOSFET, nMOS and pMOS.

Chapter-4 MOS Inverter: MOS Inverter
nMOS Inverter, Noise Margin and Transfer characteristics of nMOS Inverter, Resistive Load Inverter, Depletion Load nMOS Inverter, CMOS Inverter, Voltage Transfer characteristics of CMOS Inverter, Parameters of CMOS Inverter, Examples on CMOS Inverter, Propagation delay of CMOS Inverter.

Chapter-5 CMOS circuits: CMOS circuits
CMOS Circuits rules, CMOS NAND gate, CMOS NOR gate, Boolean function using CMOS, CMOS Multiplexer, CMOS SR Latch using NOR gates, CMOS SR Latch using NAND gates, CMOS D Latch, CMOS SR Flip Flop using NOR gates, CMOS JK Flip Flop using NOR gates, Stick Diagram, CMOS Transmission Gate, Multiplexer using Transmission gates, D Latch using Transmission gates, Boolean function implementation using transmission gates.

Chapter-6 Advanced CMOS: Advanced CMOS
Dynamic CMOS, Cascading issues of dynamic CMOS, Comparison of static CMOS and Dynamic CMOS, Domino Logic CMOS, Charge sharing in Dynamic CMOS, Boolean function implementation using dynamic CMOS, NORA CMOS logic, Boolean function implementation using NORA CMOS, Voltage Bootstrapping, Latch Up in CMOS and Latch up prevention steps, FinFET Technology.

Chapter-7 Clock, Fault and Testing of VLSI: Clock, Fault and Testing of VLSI
On Chip Clock Generation, Ring Oscillator, Clock Distribution, Faults in Integrated circuits, BIST - Bult In Self Test in Integrated circuit, Stuck at Fault.

Chapter-8 Verilog VHDL Programming: Verilog VHDL Programming

Engineering Funda channel is all about Engineering and Technology. Here this video is a part of VLSI.

#PackageTechnology #IC #VLSI #vlsidesign #EngineeringFunda
4 سال پیش در تاریخ 1399/04/19 منتشر شده است.
38,507 بـار بازدید شده
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