Underfill and glob-top encapsulation with high glass transition temperature and stress absorption.
11.7 هزار بار بازدید -
10 سال پیش
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AIT’s Underfills have the unparalleled
AIT’s Underfills have the unparalleled ability to manage stress while providing an outstanding moisture barrier. These capabilities are achieved with unconventional polymer engineering and designs. AIT’s advanced microelectronic protection products are ideal for large high performance devices operating at high temperatures.
AIT's Underfills and Glob-tops are proven for use at high temperatures of 150-300°C and beyond, in addition to traditional 150°C applications. Proven moisture insensitivity and low moisture absorption affords the possibility to meet up to the level 1 in JEDEC component reliability. RoHS, REACH and WEEE compliant to meet UL94V-0 rating.
Besides outlining the B-stageable paste and preform lid-sealing adhesives that have been used extensively for cavity package protection for over 20 years, AIT also detailed the new generation of glob-top encapsulation compounds that have been proven in recent years for advanced microelectronics with high temperature and thermal dissipation performance.
AIT glob-top encapsulants have ultra-high Tg of 175-240°C to suit the lead-free soldering processing. All of the AIT glob-top encapsulants also provide additional thermal dissipation capability in addition to mechanical protection and moisture barrier.
With over 30 years of experience in inventing and formulating specialty adhesives for electronic applications, AI Technology, Inc. (AIT) provides some of the most unique film and paste adhesives, thermal interface materials, encapsulants and coatings for electronic protection and performance requiring extreme reliability. This brochure summarizes AIT’s materials which protect against moisture and related degradation and provide stress absorption and electrical and mechanical protection.
AIT's Underfills and Glob-tops are proven for use at high temperatures of 150-300°C and beyond, in addition to traditional 150°C applications. Proven moisture insensitivity and low moisture absorption affords the possibility to meet up to the level 1 in JEDEC component reliability. RoHS, REACH and WEEE compliant to meet UL94V-0 rating.
Besides outlining the B-stageable paste and preform lid-sealing adhesives that have been used extensively for cavity package protection for over 20 years, AIT also detailed the new generation of glob-top encapsulation compounds that have been proven in recent years for advanced microelectronics with high temperature and thermal dissipation performance.
AIT glob-top encapsulants have ultra-high Tg of 175-240°C to suit the lead-free soldering processing. All of the AIT glob-top encapsulants also provide additional thermal dissipation capability in addition to mechanical protection and moisture barrier.
With over 30 years of experience in inventing and formulating specialty adhesives for electronic applications, AI Technology, Inc. (AIT) provides some of the most unique film and paste adhesives, thermal interface materials, encapsulants and coatings for electronic protection and performance requiring extreme reliability. This brochure summarizes AIT’s materials which protect against moisture and related degradation and provide stress absorption and electrical and mechanical protection.
10 سال پیش
در تاریخ 1393/08/13 منتشر شده
است.
11,783
بـار بازدید شده