How TSMC Keeps Getting Better

In 2021, TSMC fabbed about 12 to 13 million 300-millimeter wafers. Assuming each die is about 100 square millimeters large, that is about 8 billion chips. Eight billion. Semiconductor manufacturing is the most sophisticated, unforgiving high volume production technology that has ever been done successfully. You need a lot of practice. The more chips that TSMC makes, the better it gets at it. In this video, I want to talk about how a fab like TSMC improves their operations. How they think about yield, speed up throughput, and in general get better at wafer fabrication. Links: - The Asianometry Newsletter: asianometry.com/ - Patreon: www.patreon.com/Asianometry - The Podcast: anchor.fm/asianometry - Twitter: twitter.com/asianometry