Solder Joint Reliability using ANSYS Mechanical
72 بار بازدید -
6 سال پیش
-
Thermal cycling is one of
Thermal cycling is one of the most common failure mode in electronics. This is a demonstration of the Darveaux method for Solder Joint Reliability simulation using the Anand Viscoplastic Model. This technique helps engineers to predict time to failure during accelerated thermal test.
6 سال پیش
در تاریخ 1397/10/18 منتشر شده
است.
72
بـار بازدید شده